Executive Summary

Deliverable D3.5 “Assessment of measurement technologies for high-frequency electronic systems” gives an overview on the measurement technologies used in HiPERFORM project’s use cases. There are different levels of application, starting at the power module level and going up to system level monitoring. Hence the described technologies are quite diverse and tailored to the special needs per application. Starting at module level, two concepts are elaborated for securing the operation of the power module by means of integrated temperature measurements (integrated thermistor (NTC)) and short circuit monitoring (DESAT function, provided by the driver). Further on, in this deliverable, the selection of sensors for high-speed semiconductor devices are provided and reported for different use-cases such as Dual Inverter (UC4), GaN-based On-board charger (UC5), and SiC-based Off-board charger (UC6). The virtual sensors and location optimization will be reported later in D3.7 “Advanced and Virtual Sensors and Measurement”. Another aspect investigated in this document is about high-speed measurements for control platforms. In that case voltage and current measurements are looked at, to achieve control cycle loops in less than 1 µsec. Looking on integrated subsystems, one of the most important goals is to achieve optimal efficiency. For the purpose of validation, devices are required that support a high precision power measurement also with high switching frequencies, high voltages and with high currents, modern power electronics must deal with. Therefore, a section is dedicated for investigating the necessary performance for such devices and the limiting parameters. Finally, a Telematics Hardware device for sensor data collection is investigated. It is capable of collecting sensor data in a vehicle from the CAN bus and upload it to the cloud. Additionally, it can be used to start specific test cases in a testbench environment.

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