HiPERFORM booth at EFECS 2019
HiPERFORM NEWS 2019/11/22
Events   2019/11/22  

European Forum for Electronic Components and Systems

 21st Nov, Helsinki, Finland

EFECS is the international forum with a focus on ‘Our Digital Future’ along the Electronic Components and Systems value chain in Europe. The organisers of this event, AENEAS, ARTEMIS-IA, EPoSS, ECSEL Joint Undertaking and the European Commission, in association with EUREKA, have joined forces to bring all stakeholders together on 19-21 November 2019.

EFECS provided numerous opportunities to learn more about the latest developments, cooperation and funding possibilities in the ECS Community.

The HiPERFORM project was presented with an own booth by the coordination team of STUBA and AVL where videos of innovative demonstrators were shown.